| Part Number | Alternate P/N | NSN | Item Name | Manufacturer (CAGE) | FSC Details |
|---|---|---|---|---|---|
| Part Number : PAL 6L88B 4ML 883B | Alternate P/N : PAL6L88B4ML883B | NSN : 5962013601550 | Item Name : Microcircuit Memory | Manufacturer (CAGE): Mmi Amd (50364) | FSC Details : 5962 Microcircuits Electronic |
We are pleased to announce that part number PAL 6L88B 4ML 883B with NSN 5962013601550 under 5962 Microcircuits Electronic, is now ready to ship. Manufactured by Mmi Amd under CAGE Code 50364 this part is a Microcircuit Memory. Are you interested in a quick quote for PAL 6L88B 4ML 883B part number? Simply fill out the form below to begin. Your quote will take into account your answers to the fields “Needs Parts By” and “Quantity” in particular. An account manager will respond to your RFQ by email or by phone within 15 minutes of receiving this form.
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Aviation Distribution, owned and operated by ASAP Semiconductor, is a premier supplier of NSN parts, with more than 2 billion NSNs in stock. We are an AS9120B, ISO 9001:2015, and FAA AC 0056B accredited company, ready-to-ship parts and prime presence in multiple locations across the US and Canada, we can fulfill your requirements quickly and efficiently. Same day shipping and next day shipping are some of the expert services that we offer.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-360-1550 Item Description: MICROCIRCUIT,MEMORY | 5962 | 013601550 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-88515 | 5 | 1 | 4 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 303.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES MAXIMUM INPUT |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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